M7A3P1000-1FGG256
M7A3P1000-1FGG256,现场可编程门阵列(FPGA),1M Gates,272MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):1000000,系统门数量(System ...
M7A3P1000-1FG256I
M7A3P1000-1FG256I,现场可编程门阵列(FPGA),1M Gates,272MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):1000000,系统门数量(System ...
M7A3P1000-1FG144I
M7A3P1000-1FG144I,现场可编程门阵列(FPGA),1M Gates,272MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-144封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):1000000,系统门数量(System ...
M7A3P1000-1FG144
M7A3P1000-1FG144,现场可编程门阵列(FPGA),1M Gates,272MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-144封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):1000000,系统门数量(System G...
M2S150TS-1FCG1152M
M2S150TS-1FCG1152M,现场可编程门阵列(FPGA),146124 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FCBGA-1152封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):146124,逻辑单元数量(Units):146...
M2S150TS-1FC1152M
M2S150TS-1FC1152M,现场可编程门阵列(FPGA),146124 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FCBGA-1152封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):146124,逻辑单元数量(Units):1461...
M2S150T-1FCG1152M
M2S150T-1FCG1152M,现场可编程门阵列(FPGA),146124 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FCBGA-1152封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):146124,逻辑单元数量(Units):1461...
M2S150T-1FC1152M
M2S150T-1FC1152M,现场可编程门阵列(FPGA),146124 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FCBGA-1152封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):146124,逻辑单元数量(Units):14612...
M2S090TS-1FGG484M
M2S090TS-1FGG484M,现场可编程门阵列(FPGA),86316 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FPBGA-484封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):86316,逻辑单元数量(Units):86316,典...
M2S090TS-1FG484M
M2S090TS-1FG484M,现场可编程门阵列(FPGA),86316 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FPBGA-484封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):86316,逻辑单元数量(Units):86316,典型...
M2S090T-FCSG325I
M2S090T-FCSG325I,现场可编程门阵列(FPGA),86316 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FCBGA-325封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):86316,逻辑单元数量(Units):86316,典型...
M2S090T-1FGG484M
M2S090T-1FGG484M,现场可编程门阵列(FPGA),86316 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FPBGA-484封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):86316,逻辑单元数量(Units):86316,典型...
M2S090T-1FG484M
M2S090T-1FG484M,现场可编程门阵列(FPGA),86316 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FPBGA-484封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):86316,逻辑单元数量(Units):86316,典型操...
M2S090S-1FCS325IX416
M2S090S-1FCS325IX416,SMARTFUSION2 SOC FPGA,由Microsemi原厂生产,FCBGA-325封装,详细参数为:,库存实时更新.咨询购买请致电:0755-83897562
M2S090S-1FCS325I
M2S090S-1FCS325I,现场可编程门阵列(FPGA),86316 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FCBGA-325封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):86316,逻辑单元数量(Units):86316,典型...
M2S090-FCS325I
M2S090-FCS325I,现场可编程门阵列(FPGA),86316 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FCBGA-325封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):86316,逻辑单元数量(Units):86316,典型操作...
M2S050TS-1VF400I
M2S050TS-1VF400I,现场可编程门阵列(FPGA),48672 Cells,65nm (CMOS) Technology,1.2V,由Microsemi原厂生产,VFBGA-400封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):48672,逻辑单元数量(Units):4...
M2S050TS-1FGG484M
M2S050TS-1FGG484M,现场可编程门阵列(FPGA),56340 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FPBGA-484封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):56340,逻辑单元数量(Units):56340,典...
M2S050TS-1FG484M
M2S050TS-1FG484M,现场可编程门阵列(FPGA),56340 Cells,65nm Technology,1.2V,由Microsemi原厂生产,FPBGA-484封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):56340,逻辑单元数量(Units):56340,典型...
M2S050T-VF400
M2S050T-VF400,现场可编程门阵列(FPGA),48672 Cells,65nm (CMOS) Technology,1.2V,由Microsemi原厂生产,VFBGA-400封装,详细参数为:所属产品系列:SmartFusion2,逻辑单元数量(Cells):48672,逻辑单元数量(Units):4867...