U1AFS600-FGG256I,现场可编程门阵列(FPGA),600K Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(System Gates):60...
U1AFS600-FGG256,现场可编程门阵列(FPGA),600K Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(System Gates):600...
U1AFS600-FG256I,现场可编程门阵列(FPGA),600K Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(System Gates):600...
U1AFS600-FG256,现场可编程门阵列(FPGA),600K Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(System Gates):6000...
U1AFS250-FGG256I,现场可编程门阵列(FPGA),250K Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):250000,系统门数量(System Gates):25...
U1AFS250-FGG256,现场可编程门阵列(FPGA),250K Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):250000,系统门数量(System Gates):250...
U1AFS250-FG256I,现场可编程门阵列(FPGA),250K Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):250000,系统门数量(System Gates):250...
U1AFS250-FG256,现场可编程门阵列(FPGA),250K Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):250000,系统门数量(System Gates):2500...
U1AFS1500-FGG256I,现场可编程门阵列(FPGA),1.5M Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):1500000,系统门数量(System Gates):...
U1AFS1500-FGG256,现场可编程门阵列(FPGA),1.5M Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):1500000,系统门数量(System Gates):1...
U1AFS1500-FG256I,现场可编程门阵列(FPGA),1.5M Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):1500000,系统门数量(System Gates):1...
U1AFS1500-FG256,现场可编程门阵列(FPGA),1.5M Gates,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):1500000,系统门数量(System Gates):15...
RT3PE3000L-CQ256B,现场可编程门阵列(FPGA),3000000 Gates,130nm Technology,由Microsemi原厂生产,CQFP-256封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):3000000,系统门数量(System Gates):3000000...
P1AFS600-2FGG484I,现场可编程门阵列(FPGA),600K Gates,1470.59MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(Syst...
P1AFS600-2FGG484,现场可编程门阵列(FPGA),600K Gates,1470.59MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(Syste...
P1AFS600-2FGG256I,现场可编程门阵列(FPGA),600K Gates,1470.59MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(Syst...
P1AFS600-2FGG256,现场可编程门阵列(FPGA),600K Gates,1470.59MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(Syste...
P1AFS600-2FG484I,现场可编程门阵列(FPGA),600K Gates,1470.59MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(Syste...
P1AFS600-2FG484,现场可编程门阵列(FPGA),600K Gates,1470.59MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(System...
P1AFS600-2FG256I,现场可编程门阵列(FPGA),600K Gates,1470.59MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:Fusion,逻辑门数量(Gates):600000,系统门数量(Syste...
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